Intrinsic limitations on device performance and reliability from bond-constraint induced transition regions at interfaces of stacked dielectrics

The substitution of deposited alternative Sate dielectrics for thermally grown SiO(2) in aggressively scaled complementary metal-oxide-semiconductor devices requires separate and independent processing steps for (i) the oxidation of the Si substrate to form the Si-dielectric interface and (ii) the deposition of thin film dielectric. Ultrathin plasma-oxidized Si-SiO(2) interface layers which contribute approximately 0.3-0.4 nm to the overall electrical oxide thickness have been integrated into devices with Si nitride, Si oxynitride, and Ta(2)O(5) alternative dielectrics. This article proposes an analogy between (i) microscopically inhomogeneous bulk glass alloys such as GeSe(x) with 1