Material-Process Interactions in the Sequential Multilayer Process

In this paper we focus on the metallization aspect of the sequential multilayer process, with emphasis on how the material/process interactions affect the final product performance. Starting from a specific rubber modified epoxy-acrylate dielectric (described in a companion paper above), we discuss prototype processes for formation (photoimaging) and metallization of the dielectric. The conductive pattern can be obtained by wet chemical or vacuum metallization techniques, with final build by acid sulfate electroplating. The structure described was built on a Cu-patterned FR-4 substrates.