Materials for High Density Electronic Packaging and Interconnection (NOT KNOWN IF PUBLISHED BECAUSE AUTHOR HAS LEFT AT&T)

Silicon-based electronics is the acknowledged wellspring of the information era and full credit should be given for the amazing and continuing development of the silicon art. Much less credit, however, has been allotted to the packaging and interconnection circuitry that ties the systems together. In fact, the performance of advanced systems is as likely to be limited by interconnection and packaging as by the integrated circuits themselves. More money is derived from packaging and interconnection products than from silicon. When the most recent supercomputer announcements were made, by ETA and Cray, the focus was on design innovations involved in the circuit boards and packaging.