Mechanical Behavior and Reliability of Solder Joint Interconnection in Thermally Matched Assemblies (NOT PUBLISHED)

There is an obvious incentive for employing thermally matched materials in microelectronic structures, subjected to temperature changes. The strains and stresses in solder joints in such structures are due to the mismatch of solder itself with the soldered materials, as well as to the temperature differential between the assembly components. In this study we investigated the mechanical behavior and reliability of solder joint interconnections in Si-on-Si assemblies. The emphasis is on the effect of the thermal mismatch of the solder and silicon, since the effect of the temperature differential is similar to that in thermally mismatched structures.