Mechanical Behavior and Reliability of Solder Joint Interconnections In Thermally Matched Assemblies

It is obvious that matched thermal expansion (contraction) between soldered components should result in a more reliable solder joint interconnection. In this analysis we investigate, both theoretically and experimentally, the mechanical behavior and reliability of such interconnections in application to silicon-on-silicon flip-chip technology. The study is limited to the case of the uniform change in temperature (thermal cycling conditions), so that the stresses and strains in the solder joints are caused exclusively by the mismatch between the solder material and silicon.