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Microscopic mechanism of the hydrogen effect on ductility of electroless copper.

01 January 1990

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Electroless copper deposition processes are governed by the simultaneous reduction of copper and hydrogen. Therefore, the probability of incorporating atomic and/or molecular hydrogen into the deposits is high, making electroless copper more liable to high porosity and low ductility than electrolytic copper. Microscopic mechanisms for hydrogen-related embrittlement in electroless copper deposits are discussed in detail here. Examinations of the microstructures using scanning and transmission electron microscopes revealed that small (20~300angstroms) gas bubbles are incorporated uniformly throughout the films, whereas large (~2000angstroms ) bubbles are trapped at the grain boundaries.