Modeling the Power and Ground Effect of BGA Packages

(Also went to IEEE Transactions on Advanced Packaging) Ground bounce noise and power supply noise are the major concerns in the electrical design of BGA packages, therefore accurate models of the package's ground and power structures are needed for circuit simulators. This innovative new software is targeted for the engineer who, at his laptop PC, can rapidly generate accurate power and ground electrical models of an entire BGA package. The program was designed to be fast and portable contrasting other methods of modeling in which such attributes were sacrificed for greater accuracy. Operation consists of entering the available data, and in just minutes retrieving a parameter listing and two sub-circuit models simultaneously, one circuit for power and one for the ground of the package. The listing can be used as an evaluation tool for a specific package (e.g., during a design review when critical information is needed quickly) while the circuit models can be used in a SPICE circuit simulation of the IC. These separate models, designed with as few components as possible in order to reduce the complexity of the SPICE topology while still maintaining accuracy, can be either incorporated with signal package models or can be simulated alone.