Molded Hybrid IC Packages

Hybrid integrated circuits are used extensively in AT&T's switching and transmission products to achieve high levels of integration and reliability, as well as to simplify assembly and testing of large systems. AT&T's new system products will incorporate hybrid ICs with significantly more I/O connections than current designs, predominantly in surface mount package formats. We are developing a family of plastic molded packages that conform to JEDEC standards for these new hybrid IC applications. By providing hybrid ICs in packages that are identical in both appearance and performance to those of discrete ICs, we expect our customers to realize a number of benefits. System design is simplified because standard CAD libraries can be utilized to determine part location, routing, solder pad dimensions, and electrical characteristics of the package. Manufacturability is improved because industry standard equipment can be used for electrical testing, component placement, solder reflow, cleaning, and inspection. Finally, overall system reliability is improved because circuit boards can be manufactured using standardized components, equipment and processes that are better characterized and controlled.