Novel Materials/Processes for Manufacturing of Sub-micron Devices

CVD tungsten film when used as wiring metals or window plugs offers a better metal step coverage in VLSI/ULSI interconnects. However, the resulted severe tungsten roughness makes the alignment and etching of 0.5micron line/space very difficult. In this work, we report a method of depositing small grain tungsten films and discuss the advantages and the electrical results when using this new films for wiring metal and tungsten plug application.