Planarization of substrate topography by spin-coated films: A review.

Planarization of substrate topography by spin-coated organic films is reviewed in this paper. The paper first describes some areas of integrated circuit fabrication where planarization techniques are needed or may be needed in the future, and then reviews studies that characterized the planarizing capabilities of photoresist, polyimide and poly(methyl methacrylate) films. The relationship between spin coating and planarization is next discussed in an attempt to explain the limitations of the planarizing capabilities of spin-coated polymer films. Finally, some new materials that provide high degrees of planarization over large spatial distances (>50microns) are discussed.