Poly-p-xylylene as a dielectric material.

Some of the physical and electrical properties of poly-p-xylylene (PPX) films important for use as a dielectric in single and multilevel structures are reported. PPX films, 2 to 20micron thick, were vacuum deposited onto silicon wafers. Results suggest that PPX shows a significant decrease in wafer stress and lower dielectric permittivity and loss when compared to polymide. Both polymers exhibit high thermal stability in nitrogen, but PPX has a substantially lower oxidative stability. Adjusting PPX processing conditions may minimize this instability.