Processing of VLSI Application Specific Integrated Circuits

This talk will present an over view of the processes involved in fabrication of application specific integrated circuits. An introduction dealing with the growth in component count per IC, the reduction in device size and the increase in performance will be presented. The main talk will deal with VLSI fabrication, including crystal growth, photoresist and lithography operations, oxidation, implants and depositions. As an example, a simple circuit element (i.e. a flip flop) will be used to illustrate the key steps in the transformation of a schematic to an xy-mask form. The 1/2 hour talk will conclude with a discussion of some of the methods used in evaluating electrical parameters. After the talk, the video tape, "Fabrication of VLSI Microelectronic Integrated Circuits: will be shown.