Processing Technologies for the Fabrication of Long Wavelength Photonic Devices

Individual processing technologies and their sequencing for the fabrication of InP-based long wavelength (1.3microns and 1.55microns) photonic devices are described. Laser and light-emitting diode sources, and p-i- n and avalanche photodetectors are included, with emphasis on and the majority of illustrative examples coming from laser fabrication. The major types of processes involved are wet and dry etching, dielectric film deposition, contact metallization, diffusion, ion implantation, and device bonding, with many of these processes used for multiple applications. For example, dielectric film deposition is used for etch masking, growth masking, diffusion masking, reflectivity modification and contact isolation. A number of the applications involved in laser fabrication will be discussed in terms of their specific processing constraints which determine the processing technique and the usable process parameter space. Examples will given of the influence of processing on device performance and reliability. Relevant current trends in process development will be presented.