Spike annealing of boron-implanted polycrystalline-silicon on thin SiO2
19 February 2001
Spike thermal annealing is examined for electrical activation of B implants into 100 nm Si films deposited over 1.5 to 2.4 nm thermally grown SiO2. These structures simulate gate stacks in advanced p-type metal-oxide-Si (PMOS) devices. Spike anneals, at minimized thermal budget, are shown to yield higher carrier concentrations in PMOS polycrystalline-silicon (poly-Si), as compared to conventional rapid thermal annealing. The activation energy for B diffusion through SiO2 is found to be 3.71 to 3.83 eV and near that previously reported for furnace anneals. Boron penetration appears unaffected by photoexcitation from heating lamps. (C) 2001 American Institute of Physics.