TiCl4 treatment of polymer films: Application to bilevel resist schemes.
31 July 1984
Multilayer resist processing is needed to satisfy the conflicting requirements of a thick resist film necessary to planarize substrates with severe topography and a thin resist film necessary to fabricate high resolution patterns. A trilevel resist scheme(1) is presently the best candidate available to satisfy both of the above requirements, but is more complex and expensive than single layer resist processing. This has fostered a variety of studies to develop bilevel resist schemes (2,3,4) which are more simple than the trilevel scheme but retain the advantages of trilevel processing.