Universal Solders for Direct and Powerful Bonding on Semiconductors, Diamond and Optical Materials

Widely-used electronic components, optical materials and jewelry items are made up of a variety of inorganic materials such as nitrides, carbides, oxides, sulfides, fluorides, selenides, diamonds, silicon and GaAs. The surfaces of these materials are known to be very difficult to bond with low melting point solders. However, we have achieved a direct and powerful bonding on these surfaces in air, without using any flux, by using low temperature solders containing rare-earth alloying elements. The nature of the bonding is based on chemical reactions at the interface, and hence strong bonds are obtained.