Vertical Cavity Surface Emitting Lasers Flip-Chip Bonded to Gigabit/s CMOS Circuits

(PREVIOUS TITLE: VERTICAL CAVITY SURFACE EMITTING LASERS FLIP-CHIP BONDED TO CMOS CIRCUITS) We describe the first integration of Vertical-Cavity Surface-Emitting Laser (VCSEL) arrays with fast CMOS circuits via flip-chip bonding.