VLSI Device Packaging

The ever-increasing device complexity of Very Large Scale Integration (VLSI) presents diverging challenges to the integrated circuits packaging design and technology community. Memory devices, on the one hand, increase in physical size with every new generation introduced but with very little increase in the number of input/output (I/O) terminals and package size. The challenge is to package these large chips into the lowest cost package, while attaining high reliability, mechanical integrity and good electrical and thermal performance.