Ion Bombardment of Polyimide Films

With an increase in the use of polymers as dielectrics in multilevel VLSI structures, adhesion of the deposited metal layer to the underlying polymer film is becoming a matter of practical importance. Recent studies employing electron spectroscopies, such as x-ray photoelectron (XPS), ultraviolet photoelectron (UPS), and high resolution electron energy loss (HREELS), have been applied to polyimide-metal layers for the purpose of characterizing their surfaces and interfaces.