Microvolume Fatigue Test Program.
31 October 1988
Working in collaboration with engineers involved in development and reliability for both the surface mount wafer-scale integration technologies (SMT and AVP respectively), a low-cycle fatigue test program for small to ultra-small or microvolume interconnection materials has been initiated by the materials research group. The purpose of this program is to develop a data base support the fundamental understanding of low-cycle fatigue processes in small volume structures/joints used to provide both mechanical and electrical connections, focusing on interconnection material behavior during strain cycling under relevant conditions.