Novel Technique for the Evaluation of Adhesive Strength of Molding Compounds Used in Plastic Packaging

A novel technique for the evaluation of the adhesive strength in shear is suggested in application to the characterization of epoxy molding compounds used in plastic of integrated circuit devices. This technique uses bi-material co-axial cylindrical specimens, a cylindrical version of the double lap shear joint, and has been devised on a desire to minimize the influence of bending stresses, as well as to employ a simple and inexpensive process for preparation of test specimens.