Observations on Low Temperature Tape Materials: Processing and Performance

AT&T has recently established a low temperature co-fired tape facility to explore the potential of this relatively new technology. It is recognized that advanced hybrid packaging needs may be met by such an approach. The technology is viewed as a logical extension of standard thick-film processing and as a necessary step in meeting new design requirements. During circuitry and high electrical performance can be utilized by providing multilevel support structures or packages. Mechanical support has traditionally favored ceramic-type, hermetic materials, Electrical performance dictates the use of low K dielectric materials and noble metal, or copper inks, commonly employed in thick-film technology. The Advanced Hybrid Packaging & Assembly Department evaluates new, mostly ceramic-based technologies and materials and assists in the transfer of newly developed materials and processes to manufacture. Currently we are considering the use of a tape-based technology for such diverse applications as signal processors for both military and commercial markets, single-chip carriers, and microwave circuits.