Organosilicon polymers for microlithographic applications.

Organosilicon polymers are playing an increasingly important role in the electronics industry. They provide advantages in multilevel device planarization schemes because they are soluble and may be readily spin coated to afford conformal, nominally planar surfaces for subsequent metal deposition. Lithographic applications include the use of silicon containing resins for multilayer resist processes. Trilevel schemes are simplified through the use of spin on glass intermediate layers that act as oxygen RIE barriers, or alternatively, through the coupling of the properties of the top imaging layer with those of the intermediate barrier material to affect a bilevel scheme. This review outlines the chemistry associated with these materials and addresses future needs.