Oxygen RIE resistant deep UV positive resists: Poly (trimethylsilylmethy 1 methacrylate) and poly (trimethylsilylmethy 1 methacrylate- co-3-oximo-2-butanone methacrylate).
01 January 1985
The polymer, P(SiMA), derived from trimethylsilylmethyl methacrylate and the copolymer, P(Si-OM), with 3-oximino-2-butanone methacrylate are resistant to oxygen reactive ion etching in the pressure range 20 to 100micron and thus are effective patterning masks for planarizing layers such as hard baked HPR-204.