Packaging of optical MEMS devices

Recently, optical MEMS devices have gained considerable attention in the telecommunications industry-particularly in the optical networking and switching arenas. Since optical MEMS are micro-systems which rely on high precision optics, electronics and mechnaics working in close concert, these emerging devices pose some unique packaging challenges yet to be addressed by the general packaging industry. Optical MEMS packages often are required to provide both optical and electrical access, hermeticity, mechanical strength, dimensional stability and long-term reliability. Hermetic optical access necessitates the use of metallized and anti-reflection coated windows, and ever-increasing electrical I/O count has prompted the use of higher density substrate/ package technologies.