Quantification of Cleanliness Beneath Surface Mounted Discretes Assembled by Wave Soldering of Printed Wiring
01 January 1987
This paper reports on the results of an investigative program that addressed cleanliness of printed wiring surfaces beneath surface mounted passive chip discretes and SOTs. The surface mounted devices were assembled by wave soldering. The objective of this study was to determine the cleanliness attainable for and the cleaning efficiency of a number of assembly processes.