Surface Mount Solder Joint Reliability Data from Accelerated Thermal Cycle Testing of Relays, Switches, and Cylindrical Chip Resistors.
01 January 1988
Surface mount solder joint reliability evaluation on four different packages of surface mount components have been completed using accelerated thermal cycle testing. This memo documents the entire test proceedings and presents the reliability data for generic use. A particular use of this data, extrapolation to SLC(TM) product by predictive modeling, is briefly discussed.