System and Chip Considerations for Multilevel Metallization
11 March 1987
A systematized knowledge of defects in device microstructures has proven to be highly beneficial in improving materials and processes for advanced VLSI circuits. In this review, we will illustrate certain methods of defect analysis that have led to improved materials for two important modular units utilized in many VLSI circuits: namely, the 2-level poly-Si and 2-level Al structures. An overview will be also given of current and future materials needs in this area.