System level packaging of high density optoelectronic interconnections

Large telecommunication switching and transmission platforms have massive interconnection requirements which have been doubling every 12-18 months. A discontinuity in interconnection requirements and total system bandwidth caused by DWDM technology and all optical switching technology is about to cause an enormous increase in interconnection requirements. This will result in a substantial increase in the number of fibers in a system, a substantial increase in the number of optical fibers per circuit board or unit in a system, and a substantial increase in the bandwidth carried per optical fiber in a system. Totally new packaging concepts will be required to cope with rapid changes. Past changes in optoelectronic packaging have tended to be evolutionary rather than revolutionary. The early years of the 2000 decade will require revolutionary changes in optoelectronic packaging in order just to keep pace with the pacing technologies and for the demand for bandwidth