The Design of a 0.050 inch Grid High Density Connector.

A project team consisting of members from Lab 5241, Dept. 52431, Lab 1151, and AT&T-ERC/Princeton has been developing three exploratory high density connectors(HDC). All connectors provide a "butt" connection to the backplane on 0.050 in. grid( 80 I/Os per in. of circuit pack height). Two of these connectors; Circuit Pack Header and Printed/Molded connector, connect to the backplane and circuit pack through the Conductive Polymer Interconnect(CPI). One connector(Flex connector) uses a highly compliant elastomer ("Dendritic CPI") to make direct metal- to- metal connection to the backplane and circuit pack. The FASTECH(TM) 252 series shelf, with slight modifications, was used to develop the prototypes and a novel spring latch accommodates the (shelf) depth tolerance and provides the necessary force between the backplane and circuit pack. A battery of screening tests are being conducted on the HDC system by Dept. 52415. The Flex Connector is being further developed for FASTECH II by Dept. 52414. A recommendation for product development using one of the other two HDC connectors will be made by an "A-Team" by the end of 2Q87.