The impact of new materials and technology on the future of passive components.

In recent years a number of new materials have been developed for passive components and their interconnection. These include high dielectric constant lead-perovskite capacitor materials, high thermal conductivity substrate materials, and families of low-temperature, co-firing ceramic capacitor, reistor and conductor materials. New processes such as the use of organometallic precursors and sol-gel technology are being developed. These new materials and processes provide versatile, flexible designs of packaging, interconnections and assembly of devices and components.