Thermal analysis applied to electronic materials and processes.

These are two invited brief surveys for publication in the "Proceedings of the 8th International Conference on Thermal Analysis," which will appear as several volumes of the journal "Thermochimica Acta" published by Elsevier. The purpose of the first survey is to describe the basic nature and general usefulness of the technique, thermomagnetometry, and of the second to cover some of the most recent applications of the thermal analysis to the field of materials used by the electronics and communications industries.