Thermal management of an integrated power module with multiple power devices

This paper presents a thermal analysis of an integrated boost converter module by the finite element method. The basic idea in this power module is to integrate all the semiconductor devices and the snubber circuits of a boost converter on a ceramic substrate. This integration results in a more compact packaging of the boost converter with better thermal performance. Finite element analysis (FEA) is performed using the ANSYS software package. The effects of different substrates and use of multiple current sharing components are studied