THERMAL, MECHANICAL AND ENVIRONMENTAL DURABILITY DESIGN METHODOLOGIES IN ELECTRONIC PACKAGING.

Mechanical failure can result in a significant loss of electronic components during fabrication and testing, as well as during the normal operating life of the package. This problem has become especially important in the recent decade, mostly in connection with the rapidly developing VLSI technology. In our paper we address the following critical factors affecting the performance and reliability of electronic components and packages: 1) thermal control; 2) mechanical durability, including thermal and dynamic stresses; 3) environmental durability, with an emphasis on the mechanical behavior of encapsulation materials. This paper will appear as an article in the forthcoming ``Electronic Materials Handbook'', vol. 1, Packaging, ASM International, 1990.