Transient Thermal Management of Handsets Using Phase Change Materials (PCM)

Advances in the packaging of portable electronic devices communicating with wireless networks, e.g., cellular phones, continue to reduce device size while their power density increases. Designing thermal management systems to accommodate peak thermal loads as opposed to normal thermal loads can substantially increase their cost, size, and weight. The results of an experimental program to evaluate the feasibility of the transient thermal management of handsets using Phase Change Materials (PCMs) are presented.