Transmission Properties of Various Styles of Printed Wiring Boards

In the physical design of large electronic systems, the interconnection of the integrated circuits and other components at the circuit pack or printed wiring-board level constitutes a basic and relatively expensive level of interconnection. In addition to supplying power and ground, the circuit pack (CP) provides the conductor paths for the 995 Table I--Description of the circuit pack styles Circuit Pack Style Wire wrap Extender board Double-sided (epoxy) Double-sided (metal) Bonded board (LAMPAC)F 4L MLB (EXT P/G) 6L MLB (EXT P/G) 6L MLB (INT P/G) 6L MLB (INT P/G, Description Wire wrap board for breadboarding 6 layer MLB, 2 pad layers, 2 signal layers, power (P) and ground (G) on inside, dedicated ground conductor between every pair of signal conductors Double-sided, epoxy PWB Double-sided, metal core, PWB Flex bonded to epoxy coated steel 4 layer MLB, 2 signal layers, P and G on outside 6 layer MLB, 4 signal layers, P and G on outside 6 layer MLB, 2 pad layers, 2 signal layers, P and G on inside 6 layer MLB, 4 signal layers, P and G on inside