Widely Wavelength Tunable Hybrid III-V/Silicon Laser with 45 nm Tuning Range Fabricated Using a Wafer Bonding Technique

A hybrid III-V on silicon laser, integrating two intra-cavity ring resonators, is fabricated by using a wafer bonding technique. It achieves a thermal tuning range of 45 nm, with side mode suppression ratio higher than 40 dB. OCIS codes: (140.5960) Semiconductor lasers, (060.2330) Fiber optics communications