Displaying 20461 - 20470 of 37942

We consider the scattering losses of single mode fibers that are caused by microdeformations such as microbends of the fiber axis and random fluctuations of the fiber core diameter.

A survey of miniature assemblies of semiconductor devices including matched tunnel diode pairs, and decade scalers using ten tunnel diodes with graded peak currents.

We address some major trends in microelectronics, photonics, and some other areas of ``high-technology{''} engineering.

Apparatus superimposing information on aerial photographs (including time, latitude, longitude, altitude etc.) is described in some detail.

The increasing integration of microelectronics into the submicron region for VHSIC and VLSI applications necessitates the examination of these structures both for linewidth measurement and defect i

The development of solid state electronics at AT&T Bell Laboratories is traced from the invention of the point contact transistor in 1947 to the present.

SECOND-GENERATION CELLULAR SYSTEMS HAVE ENJOYED GREAT SUCCESS. THIRD-GENERATION SYSTEMS WILL PROVIDE MORE FEATURES AND GREATER FLEXIBILITY-AS SOON AS SOME TECHNICAL CHALLENGES ARE MET.

This talk describes a VLSI device - Synchronous Protocol Data Formatter with time-multiplexed serial interface (SPYDER-T) to implement the ISDN primary rate interface.

An array of miniaturized cylindrical quadrupole ion traps, with a radius of 20 mu m, is fabricated using silicon micromachining using phosphorus doped polysilicon and silicon dioxide for the purpos

As one of the first steps in our program to implement collective computation using microelectronic devices, we have made a number of chips, each containing a 22 x 22 array of wires ("axons" and "de