Publications

The standard tools for cloud computingprocessor and network virtualizationmake it difficult to achieve dependability, both in terms of real time operations and fault tolerance.

High efficiencies of >30% are predicted for series-connected tandem solar cells when current-matching is achieved between the wide-bandgap top cell and silicon bottom cell.

Interfacial (shearing and peeling) stresses in bi-material assemblies, subjected to bending on a circular mandrel, are evaluated, analyzed and discussed.

External electric leads, soldered into plated through-holes (PTHs) of printed circuit boards (PCBs), provide, in addition to electrical interconnection, mechanical support for heavy electronic comp

Mechanical strength and structural integrity of high-T sub c superconductor may play a decisive role when a superconducting material is used for practical purposes.

A die-carrier assembly subjected to external tensile forces or to bending moments applied to the ``stretchable{''} carrier is considered.

A physically meaningful analytical (mathematical) model is developed for the prediction of the interfacial shearing thermal stress in an assembly comprised of two identical components, which are su

The interfacial shearing and "peeling: stresses in an elongated bi-material assembly, adhesively bonded at the ends and subjected to the change in temperature, are predicted, based on an approximat

A simple, easy-to-apply and physically meaningful analytical ({''}mathematical{''}) stress model is developed for the prediction of the thermally induced stresses in a circular adhesively bonded as

Low-temperature thermally induced stresses in a trimaterial assembly subjected to the change in temperature are predicted based on an approximate structural analysis (strength-of-materials) analyti