Publications

We describe the use of microcontact printing and elastomeric molding for fabricating two types of devices that incorporate thin films of active organic materials: thin film transistors and plastic

This is an invited Feature Article for Journal of Polymer Sciences: Part A, Polymer Chemistry.

The study first examines the solder thickness requirements for several surface mount assembly operations. Bottom side, wave solder, surface mount assembly is of special interest.

In dark-field (DF) lithography, light from the condenser illuminates the reticle at such a steep and angle that non-diffracted light is lost from the system.

This paper describes the use of microcontact printing in an "upside-down" fabrication sequence for producing organic transistors and circuitry with critical dimensions as small as 1 micron.

This article summarizes two recently developed patterning techniques for plastic electronics: microcontact printing and thermal transfer printing.

This paper describes several "soft lithographic" techniques that use rubber stamps, molds, and conformable photomasks for micro and nanofabrication.

In recent years many applications require information from diverse sources to be linked and mined in a holistic way.

In this paper, a mechanism is presented to deal with priority inversion in real-time systems when multiple threads of execution synchronize on each other by means of mutual exclusion semaphores cou

Priority Queuing Networks By R. J. T. MORRIS (Manuscript received October 17, 1980) Priority service disciplines are widely used in computer and communications systems.