Calorimetry, light scattering, and infrared spectrophotometry have been used to investigate the formation of silica gels from alkoxides.
The evolution of specific heat of a Pd40Ni40P20 glassy alloy subjected to different degrees of non-Newtonian flow condition near the glass transition temperature, T-g, was investigated by a differe
Thermal dissipation in power electronics systems is becoming an extremely important issue with the continuous growth of-power density in their components.
Even as features are added and enhanced on portable electronic devices communicating with wireless networks, e.g., cellular phones, packaging advances continue to reduce their size.
Piezoelectric fans are receiving increased interest for thermal management applications because of their reliability, minimal power consumption, and noise-free operation.
and power dissipation level are assessed with emphasis on asym- For the past several years, the trend in electronic equipment design has been toward ever-increasing circuit speeds.
© 2018 Elsevier Ltd Pulsating flow has been found to both enhance and reduce heat transfer, although the explicit conditions that deliver heat transfer enhancement have yet to be identified.
Heat-transport measurements are reported for thermal convection in a rectangular box of aspect ratio 10 x 5.
A high-sensitivity ac calorimeter system has been developed to investigate the temperature variation of the heat capacity from free-standing liquid-crystal films.
The heat evolution of stress-induced structural disorder, DeltaH(s)(epsilon), of a Zr55Al10Ni5Cu30 bulk metallic glass (BMG) during compressive constant ram-velocity deformation at the glass transi
