Publications

Using a Si photonic integrated circuit and separate SiGe transimpedance amplifiers, we created a high-performance dual-polarization, dual-quadrature coherent receiver.

We report the fabrication of integrated and packaged active photonic probes that enable on-wafer measurements of electrical scattering parameters with a bandwidth exceeding 300 GHz, The probes use

Fiber circuits open several new methods of building systems for optical networks.

The materials and technologies that are used to interconnect and package integrated circuits are critical to achieving the cost, performance and reliability objectives of modern electronic systems.

A complete circuit design includes not only the circuit itself but also its environs.

INTRODUCTION: Many new military programs for data communications on mobile platforms require the use of fiber optic systems.

Recently, optical MEMS devices have gained considerable attention in the telecommunications industry-particularly in the optical networking and switching arenas.

Achieving an aggregated data rate of 100 Gbps and beyond is a must for all next generation optoelectronic modules, from very short reach optical links to long haul telecommunications links.

This paper presents a measured electro-optical silicon modulator based on carrier depletion in a PN junction and electromagnetic simulations for optimizing its behavior.

Computer disks have to be packaged for distribution to customers along with written customer documentation.