There is an obvious incentive for employing thermally matched materials in microelectronic structures, subjected to temperature changes.
It is obvious that matched thermal expansion (contraction) between soldered components should result in a more reliable solder joint interconnection.
Microelectronics (ME) and Fiber-Optics (FO) - two major "high- technology" areas - are an overlapping of manu scientific and engineering disciplines, such as Physics, Chemistry, Electrical Engineer
In this paper we report the observation of a new luminescence band at 1.42 eV in the low temperature (10K) spectrum for bulk GaAs crystals when they are subjected to surface damage by saw cutting,
The aim of this paper is to report on the optimization of major technological steps in the fabrication of a micro-opto-electro-mechanical system (MOEMS) composed of an actuable stack of free-standi
The aim of this paper is to report on the optimization of major technological steps in the fabrication of a micro-opto-electro-mechanical system (MOEMS) composed of an actuable stack of free-standi
The density limitations of conventional cantilever probes make it necessary to investigate alternative probing techniques for advanced VLSI package testing.
This paper discusses spring-loaded mechanical structures that can be used to make thermal connections between an object to be cooled, such as an integrated circuit, and a dissipative structure, lik
A multi layer sandwich panel of printed reflectarray (RA) is a complex composition of many different materials enabling a required performance with exceptional properties.
We have studied flux lattice melting in single crystals of YBa sub 2 Cu sub 3 O sub 7 and Bi sub(2.2) Sr sub 2 Ca sub (0.8) Cu sub 2 O sub 8 using a high-Q mechanical oscillator.
