Reliability and availability considerations are discussed in this paper with special focus on `cloud based' Mobile Switching and Application Servers (MSS and AS).
Previously crack propagation and joint failure in thermal cycling tests were correlated with recrystallization of Sn grains in SnAgCu (SAC) ball grid array (BGA) solder joints.
This study reports on a reliability investigation of AlGaN/GaN HEMTs submitted to life tests in High Temperature Operating (HTO) conditions at 150°C, 175°C, 275°C and 320°C.
The bond layer is often the weakest link in the reliability of chip packages in the integrated circuit (IC) industry.
Packaging demands for VLSI devices have increased in AT&T for the past couple of years. Many packages were originally developed using commercial multilayer ceramic technology.
In the present work, we have studied RuO sub 2 film resistors deposited onto alumina substrates with a resistance (550 KiloOhms) fixed by laser trimming (two lasers cut or kerfs were made in the re
This paper presents an analysis of the reliability of the control architecture for the communications services based on the outage statistics of the systems.
The term reliability, as applied to optical fiber splices and connectors, usually means the long term stability of the optical connection over long time periods under varying environmental conditio
Multiple-spot-beam antennas for communication satellites offer the potential for greatly increasing the traffic capacity of the satellite since the allocated frequency band can be reused in the var
Many applications require holdover of a power supply's output for 10 to 1000 milliseconds to bridge short input power line outages or dips.
