Publications

Chemical mechanical polishing (CMP) is considered to be the enabling technology for meeting the planarization requirements in 0.35 mu m feature sized multilevel semiconductor device fabrication.

CO oxidation on a platinum foil was studied in both a high pressure flow cell (10(2)-10(5) Pa) and a UHV chamber (10(- 8) to 5x10(4) Pa) both interfaced to a surface infrared spectrometer.

A simple model based upon the combination of the Langmuir- Hinshelwood surface reaction, slow catalyst deactivation by carbon, and reactive regeneration of these deactivated sites by oxygen is pre

Discriminative training refers to an approach to pattern recognition based on direct minimization of a cost function commensurate with the performance of the recognition system.

On September 15, 1998 (during the September 1998 GEM storm interval), Pc5 pulsations were observed at ground stations on both the dayside and the nightside of the Earth.

We report on the development of an ohmic metal-semiconductor contact for application in an amplifying wavegulde optical isolator.

Multilayer network optimization combined with increased network flexibility has gained much interest as the IP traffic growth (accelerated by e.g.

We study a time-compression technique motivated by the longstanding interest in transmitting multiple broadcast-quality color TV signals through a single satellite transponder, i.e., a usable RF ba

The infrared spectra of silica gels made from alkoxides are different from those made from fumed silica, and from the infrared spectra of other amorphous silicas in which the SiO sub 2 network is r

All-optical XOR functionality has been demonstrated experimentally using an integrated SOA-based Mach-Zehnder interferometer (SOA-MZI) at 20 and 40 Gb/s.