Publications

We have explored the behavior of a two-dimensional hole system in the regime of very low densities and hence large r(s).

Terrestrial radio systems employing the 10.7-11.7 GHz common carrier band have been in use for many years.

The initial stages of interface formation in the Si(100)-(2x1)/Ge and Si(111)- (7x7)/Ge systems are investigated using Rutherford Backscattering/Channeling techniques supported by Auger electron s

Solder ball shear strength is determined for ball grid array (BGA) packages in the as-received condition and after exposure to multiple solder reflow profiles (solder reflow preconditioning).

We report on the onset of reverse bias diode leakage induced by CVD selective tungsten deposition on (a) shallow n sup + (As)/p diodes made by implantation into silicon and (b) n sup + (As or P)/p

This paper describes the effect of service-time variability on the standard performance measures of a closed network of single-server queues with the first-come first-served discipline and one job

The dependence of hemepocket dynamics subsequent to carbon monoxide photolysis from human hemoglobin upon solvent viscosity has been monitored using time-resolved resonance Raman spectroscopy.

Structural and electronic properties of the three distinct classes of copper oxide based superconductors will be compared with each other and with other types of superconductors.

Ball shear testing is the most common test method used to assess solder ball attachment quality on area array packages.

This paper presents the results of a thermal fatigue study of a 2512 ceramic chip resistor assembled with various Pb free solders including SnCu, SAC105, SAC205, SAC305, and SAC405.