Ball shear testing is the most common test method used to assess solder ball attachment quality on area array packages.
This paper presents the results of a thermal fatigue study of a 2512 ceramic chip resistor assembled with various Pb free solders including SnCu, SAC105, SAC205, SAC305, and SAC405.
This paper presents the results of a thermal fatigue study of a 2512 ceramic chip resistor assembled with various Pb free solders including SnCu, SAC105, SAC205, SAC305 and SAC405.
In recent years, adaptive signal processing has been applied to a variety of areas, ranging from acoustic applications to telecommunications networks.
Low profile impinging jets provide a means to achieve high heat transfer coefficients while occupying a small quantity of space.
The quality of {111} sidewall interfaces formed during Liquid phase epitaxial regrowth around the etched mesa in EMBH laser structure has been studied using cross-sectional transmission electron mi
One-dimensional communications and two-dimensional optics may be considered special cases of a multi-dimensional communications system, the information capacity and channel capacity of which are
Weak absorption bands appear at 1720, 1227 and 1013cm sup - 1 in the infrared spectrum of Czochralski silicon.
The advent of cloud computing with remote compute and data centers is changing the way in which computing services are offered.
We show that existing methods for primary-backup replication may disrupt the timing behavior of an underlying service to the extent of making it unusable.
